Micron Technology (NASDAQ:MU) introduced a US$7 billion investment to construct a high-bandwidth reminiscence (HBM) chip-packaging facility in Singapore to satisfy rising international demand for synthetic intelligence (AI) expertise.
The power, which shall be adjoining to the US-based semiconductor producer’s present manufacturing website in Singapore, broke floor this week and is scheduled to start operations by 2026.
Designed to boost the corporate’s superior chip-packaging capabilities, the plant is predicted to create 1,400 jobs initially, with the potential to generate as much as 3,000 positions as operations scale by 2027.
In a Wednesday (January 8) announcement, Sanjay Mehrotra, Micron’s president and CEO, emphasised the rising demand for reminiscence and storage options as AI adoption accelerates throughout industries.
“With the continued help of the Singapore authorities, our funding on this HBM superior packaging facility strengthens our place to deal with the increasing AI alternatives forward,” Mehrotra commented.
Singapore continues to strengthen its place as a hub for semiconductor innovation and AI-driven applied sciences.
The town-state has attracted vital consideration from main tech gamers, with Google (NASDAQ:GOOGL) and Amazon (NASDAQ:AMZN) increasing their cloud and information middle infrastructure within the area.
Singapore has turn out to be a focus for international semiconductor manufacturing, and its authorities has supported these initiatives, recognizing the semiconductor sector as important to the nation’s economic system.
As an example, NXP Semiconductors (NASDAQ:NXPI) and a agency backed by Taiwan Semiconductor Manufacturing Company (NYSE:TSM,TPE:2330) are at the moment developing a US$7.8 billion wafer plant within the nation.
Micron’s Singapore technique enhances its work in different components of Asia, together with a US$603 million chip-packaging facility in Xi’an, China, and an US$825 million meeting and testing plant in Gujarat, India, each introduced in mid-2023.
The brand new facility will concentrate on packaging HBM chips, that are essential to high-performance computing methods like AI information facilities. These chips are designed to deal with giant quantities of information at excessive speeds.
The Singapore facility is Micron’s first superior HBM chip-packaging plant within the nation.
This previous December, the corporate additionally finalized a US$6.165 billion subsidy with the US Division of Commerce to bolster home semiconductor manufacturing beneath the CHIPS and Science Act.
Do not forget to comply with us @INN_Technology for real-time information updates!
Securities Disclosure: I, Giann Liguid, maintain no direct funding curiosity in any firm talked about on this article.
